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3D Interconnect Architectures for Heterogeneous Technologies

Modeling and Optimization

Alberto García-Ortiz, Lennart Bamberg, Jan Moritz Joseph, et al.

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Springer International Publishing img Link Publisher

Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik

Beschreibung

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

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Schlagwörter

3D Integration in VLSI Circuits, Three-dimensional integrated circuit design, heterogeneous 3D IC technologies, cross-layer optimization of 3D interconnect, 3D integration for NoC-based SoC