RF and Microwave Microelectronics Packaging II

Rick Sturdivant (Hrsg.), Ken Kuang (Hrsg.)

PDF
ca. 106,99
Amazon iTunes Thalia.de Weltbild.de Hugendubel Bücher.de ebook.de kobo Mayersche Osiander Google Books Barnes&Noble bol.com
* Affiliatelinks/Werbelinks
Hinweis: Affiliatelinks/Werbelinks
Links auf reinlesen.de sind sogenannte Affiliate-Links. Wenn du auf so einen Affiliate-Link klickst und über diesen Link einkaufst, bekommt reinlesen.de von dem betreffenden Online-Shop oder Anbieter eine Provision. Für dich verändert sich der Preis nicht.

Springer International Publishing img Link Publisher

Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik

Beschreibung

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Weitere Titel zum gleichen Preis

Kundenbewertungen

Schlagwörter

Advanced power amplifiers, Waver level packaging, High power electronics, High thermal conductivity, Chip size packaging for RF MEMS, Thermal management system design, Millimeter wave circuit technology, EMI shielding, Quality control and failure analysis, Thin film substrate, Ceramic and Laminate packaging, Microwave and millimeter-wave frequencies, System integration packaging technologies