RF and Microwave Microelectronics Packaging II
Rick Sturdivant (Hrsg.), Ken Kuang (Hrsg.)
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Springer International Publishing
Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik
Beschreibung
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Kundenbewertungen
Millimeter wave circuit technology, High power electronics, Advanced power amplifiers, Quality control and failure analysis, Ceramic and Laminate packaging, EMI shielding, System integration packaging technologies, High thermal conductivity, Chip size packaging for RF MEMS, Microwave and millimeter-wave frequencies, Thin film substrate, Thermal management system design, Waver level packaging