More-than-Moore 2.5D and 3D SiP Integration

Riko Radojcic

PDF
ca. 106,99
Amazon iTunes Thalia.de Weltbild.de Hugendubel Bücher.de ebook.de kobo Mayersche Osiander Google Books Barnes&Noble bol.com
* Affiliatelinks/Werbelinks
Hinweis: Affiliatelinks/Werbelinks
Links auf reinlesen.de sind sogenannte Affiliate-Links. Wenn du auf so einen Affiliate-Link klickst und über diesen Link einkaufst, bekommt reinlesen.de von dem betreffenden Online-Shop oder Anbieter eine Provision. Für dich verändert sich der Preis nicht.

Springer International Publishing img Link Publisher

Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik

Beschreibung

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.  

Weitere Titel zum gleichen Preis

Kundenbewertungen

Schlagwörter

3D Integrated Circuits, Fabless vs Foundry, Low-dimensional nanoensembles, 2.5/3D Integration, Advanced packaging technologies for microelectronics