Fan-Out Wafer-Level Packaging
John H. Lau
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Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik
Beschreibung
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood.
Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Kundenbewertungen
FOWLP technology, Reconstituted carrier, FOWLP with chip-first and die face-down, RDL (redistribution layer) – dielectric and conductor layers, EMC (epoxy molding compound), Temporary bonding and de-bonding, FOWLP with chip-last or RDL-first, Compression molding and PMC (post mold cure), Fan-out Panel-Level Packaging (FOPLP), Warpage and die shift, FOWLP reliability, FOWLP with chip-first and die face-up, Fan-Out Wafer-Level Packaging (FOWLP), 3D IC heterogeneous integration by FOWLP, FOWLP thermal management