Electronic Packaging Materials and Their Properties

Michael (University of Maryland, College Park, USA) Pecht, Sirus Javadpour, Rakish (DE Corp, Kokomo, Indiana, USA) Agarwal, ...

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CRC Press img Link Publisher

Naturwissenschaften, Medizin, Informatik, Technik / Maschinenbau, Fertigungstechnik

Beschreibung

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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