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Reliability of Microtechnology

Interconnects, Devices and Systems

Cristina Andersson, Olli Salmela, James E. Morris, et al.

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Springer New York img Link Publisher

Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik

Beschreibung

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

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Schlagwörter

System level reliability, Thermal fatigue, quality control, reliability, safety and risk, Microsystems, Interconnection reliability, Reliability of microsystems, Failure mechanisms of microsystems, Electrical conductive adhesives, Reliability for manufacturability, Solder joints, Reliability metrology