Semiconductor Advanced Packaging

John H. Lau

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Springer Singapore img Link Publisher

Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik

Beschreibung

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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Schlagwörter

Wafer-to-Wafer Bondind and Hybrid Bonding, Fan-in Wafer/Panel-Level Chip-Scale Package, Heterogenenous Chiplets Integration, Fan-out Wafer/Panel-Level Packaging, High Bandwidth Memeory, Thermocompression Bonding and Chip-to-Wafer Bonding, Through-silicon Vias and Redistribution-Layers, 2D, 2.1D, 2.3D, 2.5D, and 3D IC Integration, System-in-Package, Flip Chip Technology